低压注塑

low pressure injection

wide temperature and pressure under

1.Product introduction

Hot melt adhesive is made up of two poly fatty acid as black granular polymer resinbased synthesis, the fatty acid from renewable resources, through thecondensation into a two polymer, polycondensation process of the two poly fatty acid and two amine reaction, release water, generation of hot melt adhesive, this product is non corrosive, strong relay on various substrates viscosity, good waterproof seal, low melting viscosity, good fluidity, in line with the ROHS directive

【Low pressure molding of polyamide hot melt adhesivecharacteristics】

● electronic safety protection - low pressure molding;

● fast curing - substituted water cooling;

The green environmental protection, VOC does not contain volatile organic compounds;

● no residual carbon, hot melt adhesive can be used repeatedly;

● strong control, can be injection molded in relatively wide temperature and pressure under;

The security package of electronic components, low temperature and low pressure injection molding, improve production efficiency, rapid curing, protection components in harsh environment;

Having good flow properties and bonding properties, all kinds of plastics such as PVC, PA6.6, PC, ABS and metal can be sealed effectively, prevent moisture anddirt in the environment.

2 scope of application

This product is mainly used in mobile phone batteries, digital batteries at low temperature and low pressure injection molding, injection molding packaging,precision electronic components, sensors, medical equipment, PCB, encapsulation and protection of high-grade automotive wiring harness and other precisionelectronic components

3 characteristics